నైరూప్య

EXPERIMENTAL ANALYSIS OF THERMAL CONDUCTIVITY OF ENAMEL FILLED WITH MICRO AND NANO COMPOSITE OF SiO2and TiO2

Lieutenant. J. Ganesan, D. Edison Selvaraj, J.Ramathilagam

Thermal conductivity plays an important role on the thermal withstand capability of the insulating materials. It has been observed that the use of nano composites in the matrix of polymeric materials can greatly improve the thermal, mechanical and electrical properties of polymeric nano composites. A nano composite (TiO2 +SiO2) has been tested as nano filler. The micro particles of TiO2 and SiO2 are converted into nano particles with the help of ball mill. Scanning electron microscope (SEM) has been used to augment the particle size of nano composite. These nano composites were mixed with standard (Elmo Luft 1A-FD) enamel with help of ultrasonic vibrator. The thermal conductivity of enamel, micro composite (3:1, 1:3, 1:1 of SiO2 and TiO2) filled enamel and nano composite (3:1, 1:3, 1:1 of SiO2 and TiO2) filled enamel were detailed and analysed. Thermal conductivity was measured by using Lee’s Disc method. The mixing of nano composites of SiO2 and TiO2 with enamel in various proportions has no improvement when compared to the thermal conductivity of the enamel and the enamel filled with micro composites of SiO2 and TiO2 but reduced thermal conductivity when compared to that of SiO2 and TiO2. The enamel and micro composite of SiO2 and TiO2 taken in the proportion of 3:1 filled enamel has same value of thermal conductivity.